Features of magnetic ponderomotive interaction of magnetized to saturation profiled magnetic films
- Autores: Piatakov M.A.1, Akimov M.L.1, Polyakov P.A.1
- 
							Afiliações: 
							- Chair of General Physics, Faculty of Physics, Lomonosov Moscow State University
 
- Edição: Volume 87, Nº 11 (2023)
- Páginas: 1658-1661
- Seção: Articles
- URL: https://rjeid.com/0367-6765/article/view/654569
- DOI: https://doi.org/10.31857/S0367676523702861
- EDN: https://elibrary.ru/FIPHYY
- ID: 654569
Citar
Texto integral
 Acesso aberto
		                                Acesso aberto Acesso está concedido
						Acesso está concedido Acesso é pago ou somente para assinantes
		                                							Acesso é pago ou somente para assinantes
		                                					Resumo
We calculated the force of magnetic ponderomotive interaction between two micromagnetic films having a corrugated semi-cylindrical surface represented as a lattice of half magnets in the form of long cylindrical rods. It is found that the lattice interaction force is substantially determined by the distance between the half-cylinders and, depending on this parameter, can manifest itself as an attraction or repulsion force.
Sobre autores
M. Piatakov
Chair of General Physics, Faculty of Physics, Lomonosov Moscow State University
							Autor responsável pela correspondência
							Email: f33261033444444@yandex.ru
				                					                																			                												                								Russia, 119991, Moscow						
M. Akimov
Chair of General Physics, Faculty of Physics, Lomonosov Moscow State University
														Email: f33261033444444@yandex.ru
				                					                																			                												                								Russia, 119991, Moscow						
P. Polyakov
Chair of General Physics, Faculty of Physics, Lomonosov Moscow State University
														Email: f33261033444444@yandex.ru
				                					                																			                												                								Russia, 119991, Moscow						
Bibliografia
- Nozaki T., Yamamoto T., Miwa S. et al. // Micromachines. 2019. V. 10. No. 5. Art. No. 327.
- Беляев Б.А., Бабицкий А.Н., Боев Н.М., Галеев Р.Г. // Изв. вузов. Физика. 2016. Т. 58. № 8/2. С. 75.
- An Z., Han X., Mauger M. et al. // IEEE TPEL. 2022. V. 37. No. 10. P. 12391.
- Brearton R., Burn D.M., Haghighirad A.A. et al. // Phys. Rev. B. 2022. V. 106. Art. No. 214404.
- Фролов Г.И. // ЖТФ. 2001. Т. 71. № 12. С. 50; Frolov G.I. // Tech. Phys. 2001. V. 46. No. 12. P. 1537.
- Edwards B.F., Johnson B.A., Edwards J.M. // Chaos. 2020. V. 30. No. 1. Art. No. 013146.
- Edwards B.F., Johnson B.A., Edwards J.M. // Chaos. 2020. V. 30. No. 1. Art. No. 013131.
- Edwards B.F., Edwards J.M. // Eur. J. Phys. 2017. V. 38. No. 1. Art. No. 015205.
- Robertson W., Cazzolato B., Zander A. // IEEE Trans. Magn. 2011. V. 47. No. 8. P. 2045.
- Vokoun D., Beleggia M., Heller L., Sittner P. // J. Magn. Magn. Mater. 2009. V. 321. No. 22. P. 3758.
- Пятаков М.А., Поляков П.А., Русакова Н.Е. // Изв. РАН. Сер. физ. 2020. Т. 84. № 5. С. 719; Piatakov M.A., Polyakov P.A., Rusakova N.E. // Bull. Russ. Acad. Sci. Phys. 2020. V. 84. No. 5. P. 593.
- Пятаков М.А., Акимов М.Л., Поляков П.А. // Изв. РАН. Сер. физ. 2021. Т. 85. № 11. С. 1568; Piatakov M.A., Akimov M.L., Polyakov P.A. // Bull. Russ. Acad. Sci. Phys. 2021. V. 85. No. 11. P. 1230.
- Акимов М.Л., Пятаков М.А., Поляков О.П., Поляков П.А. // Изв. РАН. Сер. физ. 2022. Т. 86. № 9. С. 1251; Akimov M.L., Piatakov M.A., Polyakov O.P., Polyakov P.A. // Bull. Russ. Acad. Sci. Phys. 2022. V. 86. No. 9. P. 1037.
- Алиев И.Н., Копылов И.С. // Вестн. МГТУ им. Н.Э. Баумана. Сер. “Естественные науки”. 2015. № 6. С. 25.
- Choi H.S., Park I.H., Lee S.H. // IEEE Trans. Magn. 2006. V. 42. No. 4. P. 663.
- Seo J.H., Choi H.S. // IEEE Trans. Magn. 2014. V. 50. No. 2. Art. No. 7012904.
Arquivos suplementares
 
				
			 
						 
						 
					 
						 
						 
									

 
  
  
  Enviar artigo por via de e-mail
			Enviar artigo por via de e-mail 

